The higher the performance of electronic parts, the higher the severity of thermal problems. Because of the reduction in the development cycle for new products and large-scale integration design for these parts, the difficulty of protecting against heat is increasing. In order to raise the efficiency of heat protection in electronics, a thermal pad is installed between the heating component and the heat sink. Thermal conductivity can be increased through minimization of the grounded area and adding thermal conductive material.
The thermal density of personal computers is high from processing large amounts of data in a small space. Therefore, a heat protection pad is essential, and the heat protection requirements increase as PCs continue to develop.
Due to limitations in space and contact temperatures in medical devices, distributing heat can be difficult. There is a need for the integration of R&D, data, and service in order to create heat distribution smoothly within these confines.
In all industrial fields, the strictest standards are applied to military products. They must pass tests for reliability, flame resistance, and dustproofing. Thorough heat management is essential in order to maintain reliability in any situation.
Reliability is maximized in extreme conditions through preliminary thermal simulation analysis, custom prototype production, and trial production processes.