Defense
ROC286BB

1U Rugged Fanless AC-DC Redundant System with Intel® Coffee Lake-Refresh 8th/9th CPU (Up to 65W), 2 x DisplayPort, 1 x HDMI, 1 x PCIe x16, 6 x USB,~90~260V AC-IN*2 Redundant support, Extended Temp. -30°C to 70°C

  • Intel® Coffee Lake-Refresh 8th/9th Processor(Up to 65W)
  • Intel®Q370 Chipset
  • 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
  • Front IO: 2x2.5”SATA HDD/SSD easy swap tray,2xUSB2.0
  • Back IO: 2xCOM,4xUSB3.1,2xDP,2xLAN,1xLine-out/Mic
  • 2 x 200W AC-DC Power Supply with Redundant support
  • Wide range 90~260V AC-IN
  • Extended Operating Temperature -30 to 70°C
Specifications
System
High Performance Processor Socket LGA 1151 for Intel® Core i7/i5/i3/Celeron® (Supports up to 65W) Intel® 8th/9th Processor
Memory type 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
Chipset Intel® Q370 Chipset
Expansion Slot 1 x PCIex16

1x M.2 (Key M, 2242/2280) with PCIe and SATA Signal
Storage
HDD/SDD 2 x 2.5” SATA HDD/SSD easy swap tray
Ethernet
Ethernet Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports)
Rear I/O
Display Port 2 x DP
HDMI 1 x HDMI
Ethernet 2 x RJ45 Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps)
Audio 2 x 3.5mm Audio Jacks (1 x MIC, 1 x Line-Out)
COM 2 x RS232/422/485 (422 / 485 select by BIOS)
USB Port 4 x USB 3.1(10Gb/s)
AC-IN 2 x AC Inlet ; 90~260V
Front I/O
Button 9V~36V DC-IN, 2 x 150W DC/DC Redundant Power Supply
Indicator LED HDD
USB Port 2 x USB 2.0
Easy Swap SSD Tray 2
Applications, Operating System
Applications Commercial and Industrial Platforms, Embedded Computing, Process Control,

Intelligent Automation and manufacturing applications
Operating System Windows 10 64Bit

Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20
Physical
Dimension 440 x430 x 44 mm
Weight 8.5Kg
Chassis SECC
Heatsink Aluminum Alloy, Corrosion Resistant
Finish Anodic aluminum oxide
Environmental
MIL-STD-810G Test Method 507.5, Procedure II (Temperature & Humidity)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)
Green Product RoHS compliance
Operating Temperature w/o Graphic Card (ET: -20 to 60°C; UT: -30 to 70°C) ; w/Graphic Card (0 to 50°C)
Storage Temperature -40 to 85°C
Relative Humidity 5% to 95%, non-condensing
EMC CE and FCC compliance
LIST