Defense
ROC286B
1U Rugged Fanless System with Intel® Coffee Lake-Refresh 8th/9th Processor(Up to 65W), 2 x DisplayPort, 1 x HDMI, 1 x PCIe x16, 6 x USB,~100~240V AC-IN ,Extended Temp. -30°C to 70°C
- Intel® Coffee Lake-Refresh 8th/9th Processor(Up to 65W)
- Intel®Q370 Chipset
- 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB
- Front IO: 2x2.5”SATA HDD/SSD easy swap tray,2xUSB2.0
- Back IO: 2xCOM,4xUSB3.1,2xDP,2xLAN,1xLine-out/Mic
- Wide range 100~240V AC-IN
- Extended Operating Temperature -30 to 70°C
System | |
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High Performance Processor | Socket LGA 1151 for Intel® Core i7/i5/i3/Celeron® (Supports up to 65W) Intel® 8th/9th Processor |
Memory type | 2 x SO-DIMM DDR4 2400/2666 MHz up to 64GB |
Chipset | Intel® Q370 Chipset |
Expansion Slot |
1 x PCIex16 1x M.2 (Key M, 2242/2280) with PCIe and SATA Signal |
Storage | |
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HDD/SDD | 2 x 2.5” SATA HDD/SSD easy swap tray |
Ethernet | |
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Ethernet | Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps for x2 RJ45 ports) |
Rear I/O | |
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Display Port | 2 x DP |
HDMI | 1 x HDMI |
Ethernet | 2 x RJ45 Intel® I210 & I219LM GbE LAN (support 10/100/1000 Mbps) |
Audio | 2 x 3.5mm Audio Jacks (1 x MIC, 1 x Line-Out) |
COM | 2 x RS232/422/485 (422 / 485 select by BIOS) |
USB Port | 4 x USB 3.1(10Gb/s) |
AC-IN | 1 x AC Inlet ; 90~260V |
Front I/O | |
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Button | 1 x Power Button w/Indicator LED |
Indicator LED | HDD |
USB Port | 2 x USB 2.0 |
Easy Swap SSD Tray | 2 |
Applications, Operating System | |
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Applications |
Commercial and Industrial Platforms, Embedded Computing, Process Control, Intelligent Automation and manufacturing applications |
Operating System |
Windows 10 64Bit Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20 |
Physical | |
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Dimension (W x D x H) | 440 x430 x 44 mm |
Weight | 8.5Kg |
Chassis | SECC |
Heatsink | Aluminum Alloy, Corrosion Resistant |
Finish | Anodic aluminum oxide |
Environmental | |
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MIL-STD-810G Test |
Method 507.5, Procedure II (Temperature & Humidity) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
Green Product | RoHS compliance |
Operating Temperature | w/o Graphic Card (ET: -20 to 60°C; UT: -30 to 70°C) ; w/Graphic Card (0 to 50°C) |
Storage Temperature | -40 to 85°C |
Relative Humidity | 5% to 95%, non-condensing |
EMC | CE and FCC compliance |