IEC-61850-3, IEEE-1613 2U Fanless Reduntant Computer ,Intel®10th Gen Xeon W-1290TE / Core i9-10900TE , 10GbE LAN, 1 x IPMI Support, 2 x 200W AC/DC Redundant Power Supply, Operating Temperature -20°C to 60°C

  • Intel 10th Gen Xeon® W-1200/ Core i Processor
  • 4 x DDR4 up to 128GB
  • 10GbE LAN (by option), 1 x IPMI Support
  • 2 x RJ45 GbE LAN, 2 x RJ45 10GbE ,4 x USB3.2, 4 x USB2.0,
  • 2 x DP, 1 x VGA, 1 x DVI-D
  • 4 x 2.5” Easy swap SSD/HDD Tray (Support RAID 0,1,5,10)
  • 3 x PCIe Expansion Slots
  • Trusted Platform Module
  • FDTI ( Security Module By Options)
  • -20~+60 Extended Temperature
10th Generation Intel® Xeon® W-1200 Processors

Intel® Xeon® W-1290TE Processor (20M Cache, up to 4.50 GHz)

Intel® Xeon® W-1250TE Processor (12M Cache, up to 3.80 GHz)

10th Generation Intel® Core™ i9/i7/i5 Processors

Intel® Core™ i9-10900TE(20M Cache, up to 4.60 GHz)

Intel® Core™ i7-10700TE(16M Cache, up to 4.50 GHz)

Intel® Core™ i5-10500TE(12M Cache, up to 3.70 GHz)
Memory type 4 x DDR4 up to 128GB
Expansion Slot 1 PCI-E 3.0 x16

2 PCI-E 3.0 x4
Storage Device 4 x 2.5” Easy swap HDD/SSD Tray (Support RAID 0,1,5,10)
Rear I/O
Power Button 1 with backlight
USB 2 x USB 2.0
Front I/O
Power Input 2 x 100V~240V AC-IN
LAN 2 x RJ45 GbE LAN ; 2 x RJ45 10GbE LAN (by option) ; 1 x IPMI
USB 4 x USB 3.2
DisplayPort 2 x DP
Dual 10GbE SFP+ Module INTEL X710 Dual 10GbE SFP+ LAN card
Power Input 100V~240V AC-IN, 2 x 200W AC/DC Redundant Power Supply
OS support list
Windows Windows 10 x64
Linux Ubuntu, Red Hat
Mechanical and Environmental
Dimension 430 x 450 x 88 mm ( W x D x H )
Operating Temp. -20 to 60°C
Storage Temp. -40°C to 85°C
Relative Humidity 5% to 95%, non-condensing
Standards CE, FCC, MIL-STD 810G Compliance
System Design Fanless
Mounting 2U Rackmount
MIL-STD-810G Method 507.5, Procedure II (Temperature & Humidity)

Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)

Method 516.6 Shock-Procedure I Operating (Mechanical Shock)

Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24,


Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)

Method 501.5, Procedure I (Storage/High Temperature)

Method 501.5, Procedure II (Operation/High Temperature)

Method 502.5, Procedure I (Storage/Low Temperature)

Method 502.5, Procedure II (Operation/Low Temperature)

Method 503.5, Procedure I (Temperature shock)
EMC CE, FCC compliant
Green Product RoHS, WEEE compliance